Application: To Remove thickness of test specimens of thermoplastic, elastomeric and cross linked polyethylene material having width between: 12.5 mm & 125 mm with thickness not exceeding 10 mm in accordance to:
Wafer Cutting Facility: 0.5 to 2.0mm thickness, Max Diameter of Sample: 125mm. 3 set of dies are included with the machine. All other dies at additional cost are available.
A video of the equipment is available on request.